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10G XFP LR Transceiver

10G XFP LR Transceiver

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Description

Description

FT-MTRX-02X13-Gis a high performance, cost effective modules, which is optimized for 10G SONET/SDH and WAN applications, supporting data-rate of 9.953Gbps to 11.1Gbps, and transmission distance up to 10km.

The transceiver consists of two sections: The transmitter section incorporates a 1310nm uncooled DML, driver and CDR. The receiver section consists of a PIN photodiode integrated with a transimpedance preamplifier (TIA) , LA and CDR. The module is hot pluggable into the 30-pin connector. The high-speed electrical interface is base on low voltage logic, with nominal 100 Ohms differential impedance and AC coupled in the module. The optical output can be disabled by LVTTL logic high-level input of TX_DIS. Loss of signal (RX_LOS) output is provided to indicate the loss of an input optical signal of receiver.

A serial EEPROM in the transceiver allows the user to access transceiver monitoring and configuration data via the 2-wire XFP Management Interface. This interface uses a single address, A0h, with a memory map divided into a lower and upper area. Basic digital diagnostic (DD) data is held in the lower area while specific data is held in a series of tables in the high memory area.

Features

Support 10GE application at the data-rate of 9.953Gbps to 11.1Gbps

Up to 10km transmission

1310nm uncooled DML and PIN receiver

XFI electrical interface

2-wire interface for integrated Digital Diagnostic monitoring

XFP MSA package with duplex LC connector

Hot pluggable

Very low EMI and excellent ESD protection

+3.3V power supply

Power consumption less than 2 W

Operating Case Temprature:0~+70

Application

SONET(OC-192)/SDH(STM64) line card

10GBASE-LR at 10.3125Gbps

10GBASE-LW at 9.953Gbps

10GE Ethernet switches and routers

Standard

Compliant with SFF-INF-8077i

RoHS compliance

GR-468-CORE

MIL-STD-883

Specification

Absolute Maximum Ratings

Parameter

Symbol

Min.

Max.

Unit

Storage Temperature

TS

-40

+85

Supply Voltage

VCC3

-0.5

3.6

V

Relative Humidity

RH

-5

+95

%

RX Input Average Power

Pmax

-

0

dBm

Recommended Operating Conditions

Parameter

Symbol

Min.

Typical

Max.

Unit

Operating Case Temperature

TC

0

-

+70

Power Supply Voltage

VCC3

3.135

3.3

3.475

V

Power Supply Current

ICC3

-

-

575

mA

Power Dissipation

PD

-

-

2

W

Data Rate

9.953

-

11.1

Gbps

Transmission Distance

-

10

Km

Transmitter Operating Characteristic-Optical

Parameter

Symbol

Min.

Typical

Max.

Unit

Note

Center Wavelength

λC

1290

1310

1330

nm

Note1

Spectral Width(-20dB)

Pm

-

-

1

nm

Side Mode Suppression Ratio

SMSR

30

-

-

dB

Laser Off Power

Poff

-

-

-30

dBm

Average Optical Power

Pavg

-6

-

-1

dBm

Note1

Extinction Ratio

ER

6

-

-

dB

Transmitter and Dispersion Penalty

TDP

-

-

1

dB

Relative Intensity Noise

Rin

-

-

-128

dB/Hz

Operating Data Rate

9.953

-

11.1

Gbps

Optical Eye Mask

5%

Notes:

[1] Average optical power shall be measured using the methods specified in TIA/EIA-455-95.

Receiver Operating Characteristic-Optical

Parameter

Symbol

Min.

Typical

Max.

Unit

Note

Center Wavelength

λr

1270

1600

nm

Receiver Sensitivity (Average Power)

Psens

-

-14.4

dBm

Note1

Stressed Sensitivity

-

-

-10.3

dBm

Note1

Los Assert

LosA

-32

-

-

dBm

Los Dessert

LosD

-

-

-15.4

dBm

Los Hysteresis

LosH

0.5

-

6

dB

Overload

Pin

0.5

-

-

dBm

Optical Return Loss

ORL

14

dB

Receiver reflectance

Rr

-14

dB

Operating Data Rate

9.953

-

11.1

Gbps

Sensitivity in OMA

-12.6

dBm

Max Input power

0.5

-

-

dBm

Notes:

[1] Receiver sensitivity is informative. Stressed receiver sensitivity shall be measured with conformance test signal for BER =1x 10-12 .

Low Speed Control and Alarm Signals Electrical Interface

Parameter 

 Symbol 

 Min 

 Max 

 Units 

 Note 

Differential data input swing

Vin

120

820

mVpp

Differential data output swing

Vout

340

850

mVpp

 XFP Interrupt, Mod_NR, RX_LOS 

Vol

0.0

0.4

V

Note1

Voh

VCC3-0.5

VCC3+0.3

Note2

 XFP TX_DIS, P_DOWN/RST 

Vil

-0.3

0.8

V

Note3

Vih

2.0

VCC3+0.3

Note4

 XFP SCL and SDA Output 

Vol

0.0

0.4

V

Note1

Voh

VCC3-0.5

VCC3+0.3

Note2

 XFP SCL and SDA Input 

Vil

-0.3

VCC3*0.3

V

Note5

Vih

VCC3*0.7

VCC3+0.5

Note6

 Capacitance for XFP SCL and SDA I/O pin 

Ci

-

14

Pf

 Total bus capacitive load for SCL and SDA 

Cb

-

100

Pf

Note7

-

400

Pf

Note8

Notes:

[1] Pull-up resistor must be connected to host_Vcc on the host board. Iol(max)=3mA

[2] Pull-up resistor must be connected to host_Vcc on the host board.

[3] Pull-up resistor connected to VCC3 within XFP module. Iil(max)= -10 uA

[4] Pull-up resistor connected to VCC3 within XFP module. Iih(max)= 10 uA

[5] Pull-up resistor must be connected to host_Vcc on the host board. Iol(max)= -10 uA

[6] Pull-up resistor must be connected to host_Vcc on the host board. Iol(max)= 10 uA.

[7] At 400KHz, 3.0kohms, at 100kHz 8.0kohms max.

[8] At 400KHz, 0.8kohms, at 100kHz 2.0kohms max.

 

 

 

 

Important Notice

Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.

The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.

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